Picosun Sprinter & Cluster Platform: from product launch to acquisition by Applied Materials
CONTEXT
As Project then Product Manager at Picosun, I led the full development of the Sprinter platform and its cluster configuration, a strategic move to enter the 300 mm wafer High Volume Manufacturing (HVM) semiconductor market.
SCOPE OF WORK
- · End-to-end product development & roadmap ownership
- · SEMI S2/S8/S14/F47 readiness
- · 300 mm HVM market entry strategy
- · Customer contract negotiation (Canon)
- · 3-month on-site commissioning & customer-compliance qualification
OUTCOME
- · +30% turnover in the first year of commercialisation
- · Successful entry into the 300 mm HVM market
- · Signed contract with Canon
- · Contributed to Picosun's acquisition by Applied Materials

